Inventor · Singapore, SG

Yonggang Jin

42Patents
6h-index
30Co-inventors
65Inventor score

Filing activity: Apr 16, 2004 → Sep 20, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US8664044B2 Method of fabricating land grid array semiconductor package Emerging Cross-Sectional Technologies 275 Active
US8779601B2 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture Electricity 26 Active
US8916481B2 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture Electricity 26 Active
US8119454B2 Manufacturing fan-out wafer level packaging Electricity 9 Active
US8535980B2 Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package Emerging Cross-Sectional Technologies 7 Active
US9252030B1 System-in-packages and methods for forming same Electricity 7 Active
US8617987B2 Through hole via filling using electroless plating Emerging Cross-Sectional Technologies 6 Active
US9013037B2 Semiconductor package with improved pillar bump process and structure Electricity 5 Active
US9013017B2 Method for making image sensors using wafer-level processing and associated devices Electricity 4 Active
US8860207B2 Method of fabricating land grid array semiconductor package Emerging Cross-Sectional Technologies 4 Active
US8766422B2 Through hole via filling using electroless plating Electricity 3 Active
US9831357B2 Semiconductor optical package and method Electricity 3 Active
US9448216B2 Gas sensor device with frame passageways and related methods Electricity 3 Active
US9012269B2 Reducing warpage for fan-out wafer level packaging Electricity 3 Active
US7443039B2 System for different bond pads in an integrated circuit package Electricity 2 Active
US8937008B2 Apparatus and method for placing solder balls Electricity 2 Active
US8796139B2 Embedded wafer level ball grid array bar systems and methods Electricity 2 Active
US8728831B2 Reconstituted wafer warpage adjustment Electricity 1 Active
US11105638B2 Method, apparatus, and computer readable storage medium for updating electronic map Physics 1 Active
US10789771B2 Method and apparatus for fusing point cloud data Physics 1 Active
US11341678B2 Device and method for calculating a vehicle trailer pose using a camera Physics 1 Active
US9059058B2 Image sensor device with IR filter and related methods Electricity 1 Active
US10878621B2 Method and apparatus for creating map and positioning moving entity Physics 1 Active
US9780080B2 Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavity Electricity 0 Active
US8349710B2 Shielding techniques for an integrated circuit Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.