Flare-reducing imaging system and associated image sensor
US9781362B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2016 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Mar 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. The bonding wire is electrically connected to the bonding pad and has a region forming a non-zero angle with respect to the substrate top surface. The non-zero angle is in at least one of a lower and an upper angular range for minimizing reflection of incident light on the region from reaching the image sensor. The lower angular range is selected such that the region reflects the incident light away from the pixel array toward a plane including the lens. The upper angular range is selected such that the region reflects the incident light to a clearance between the bonding pad and the pixel array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.