Method for ascertaining distortion properties of an optical system in a measurement system for microlithography
US9785058B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Dec 20, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/95676
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for ascertaining distortion properties of an optical system in a measurement system for microlithography is provided, wherein the optical system images at least one structure to be measured into a measurement image. In accordance with one aspect, a method according to the invention comprises the following steps: measuring the field-dependent image aberrations of the optical system; determining a first distortion pattern present in the first image field generated by the optical system during measurement of at least one predefined structure; carrying out an optical forward simulation for the predefined structure taking account of the field-dependent image aberrations measured previously, with a second image field being generated; determining a second distortion pattern for the second image field generated previously; and ascertaining the structure-independent distortion properties of the optical system by calculating a third distortion pattern as the difference between the first distortion pattern and the second distortion pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.