Patent · US Active

Method for ascertaining distortion properties of an optical system in a measurement system for microlithography

US9785058B2 · kind B2 · utility

0Cited by
2References
10Claims
0Family size

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Key dates

Filing dateAug 13, 2015
Grant dateOct 10, 2017
Priority date
Expiry dateDec 20, 2035

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N2021/95676
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method for ascertaining distortion properties of an optical system in a measurement system for microlithography is provided, wherein the optical system images at least one structure to be measured into a measurement image. In accordance with one aspect, a method according to the invention comprises the following steps: measuring the field-dependent image aberrations of the optical system; determining a first distortion pattern present in the first image field generated by the optical system during measurement of at least one predefined structure; carrying out an optical forward simulation for the predefined structure taking account of the field-dependent image aberrations measured previously, with a second image field being generated; determining a second distortion pattern for the second image field generated previously; and ascertaining the structure-independent distortion properties of the optical system by calculating a third distortion pattern as the difference between the first distortion pattern and the second distortion pattern.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.