All intermetallic compound with stand off feature and method to make
US9793232B1 · kind B1 · utility
1Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2016 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Jan 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A standoff structure for providing improved interconnects is provided, wherein the structure employs nickel copper alloy or copper structures having increased resistivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.