Semiconductor package and manufacturing method thereof
US9793251B2 · kind B2 · utility
2Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Nov 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a semiconductor package in which a semiconductor chip and a mounting device are packaged together. The semiconductor package includes a semiconductor chip, a mounting block on which a first mounting device is mounted on a substrate that includes a circuit formed thereon, and an interconnection part configured to electrically connect the semiconductor chip to the mounting block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.