Inventor · Daejeon, KR

Jun Kyu Lee

29Patents
4h-index
74Co-inventors
66Inventor score

Filing activity: Dec 18, 1996 → Mar 6, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7736042B2 Back light unit Emerging Cross-Sectional Technologies 42 Active
US9653397B2 Semiconductor package and method of manufacturing the same Electricity 15 Active
US5901716A Wafer cleaning apparatus with rotating cleaning solution injection nozzles Emerging Cross-Sectional Technologies 9 Expired
US8237276B2 Bump structure and fabrication method thereof Emerging Cross-Sectional Technologies 6 Active
US11011502B2 Semiconductor package Electricity 4 Active
US10957654B2 Semiconductor package and method of manufacturing the same Electricity 3 Active
US9754892B2 Stacked semiconductor package and manufacturing method thereof Electricity 3 Active
US7416758B2 Slit coater Performing Operations; Transporting 3 Expired
US6447823B1 Liquid yogurt with encapsulated lactic acid bacteria and method for producing the same Human Necessities 2 Expired
US9793251B2 Semiconductor package and manufacturing method thereof Electricity 2 Active
US10468895B2 Charger with improved heat radiation and the manufacturing method thereof Electricity 1 Active
US10381312B2 Semiconductor package and method of manufacturing the same Electricity 1 Active
US11825599B2 Air-pocket prevention PCB, air-pocket prevention PCB module, electrical device including the same, and manufacturing method of electrical device including the same Electricity 0 Active
US12028985B2 Electrical device having heat dissipation structure using filler and manufacturing method of the same Electricity 0 Active
US11450535B2 Manufacturing method for semiconductor package including filling member and membrane member Electricity 0 Active
US11955755B2 Electric appliance and adapter Electricity 0 Active
US11065859B2 Device and method for disassembling solar cell module Emerging Cross-Sectional Technologies 0 Active
US11783989B2 Transformer Electricity 0 Active
US10880610B2 Method for providing additional contents at terminal, and terminal using same Electricity 0 Active
US11264330B2 Chip package with connection portion that passes through an encapsulation portion Electricity 0 Active
US12198997B2 Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients Electricity 0 Active
US11939334B2 Substituted pyrimido[4,5-b][1,4]diazepines as PLK1 degradation inducers Chemistry; Metallurgy 0 Active
US9855605B2 Method of manufacturing metal powders and apparatus for manufacturing metal powders realizing the same Performing Operations; Transporting 0 Active
US12205904B2 Wafer-level design and wiring pattern for a semiconductor package Electricity 0 Active
US11912710B2 Substituted pyrimido[4,5-b][1,4]diazepines as PLK1 degradation inducers Chemistry; Metallurgy 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.