Patent assignee · KR · COMPANY

Nepes Co., Ltd.

35Patents
33Active
35Granted
49Portfolio score

Filing activity: Sep 30, 2004 → Nov 11, 2021 · 9 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7977789B2 Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same Electricity 54 Active
US9653397B2 Semiconductor package and method of manufacturing the same Electricity 15 Active
US9502391B2 Semiconductor package, fabrication method therefor, and package-on package Electricity 13 Active
US7808095B2 Ultra slim semiconductor package and method of fabricating the same Electricity 10 Active
US7170170B2 Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package Electricity 7 Expired
US8093721B2 Flip chip semiconductor package and fabrication method thereof Electricity 6 Active
US8237276B2 Bump structure and fabrication method thereof Emerging Cross-Sectional Technologies 6 Active
US8421211B2 Wafer level semiconductor package and fabrication method thereof Electricity 5 Active
US11011502B2 Semiconductor package Electricity 4 Active
US7919833B2 Semiconductor package having a crack-propagation preventing unit Electricity 4 Active
US7906842B2 Wafer level system in package and fabrication method thereof Electricity 4 Active
US9754892B2 Stacked semiconductor package and manufacturing method thereof Electricity 3 Active
US10957654B2 Semiconductor package and method of manufacturing the same Electricity 3 Active
US9564411B2 Semiconductor package and method of manufacturing the same Electricity 3 Active
US9793251B2 Semiconductor package and manufacturing method thereof Electricity 2 Active
US10381312B2 Semiconductor package and method of manufacturing the same Electricity 1 Active
US7952210B2 Semiconductor package and fabrication method thereof Electricity 1 Active
US9006872B2 Semiconductor chip package having via hole and semiconductor module thereof Electricity 1 Active
US11276632B2 Semiconductor package Electricity 1 Active
US7491572B2 Method for fabricating an image sensor mounted by mass reflow Electricity 1 Expired
US11948891B2 Semiconductor package and manufacturing method thereof Electricity 0 Active
US11450535B2 Manufacturing method for semiconductor package including filling member and membrane member Electricity 0 Active
US11674047B2 Composition for manufacturing passivation layer and passivation layer using the same Chemistry; Metallurgy 0 Active
US11476211B2 Semiconductor package and manufacturing method thereof Electricity 0 Active
US12198997B2 Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.