Patent · US Active

Methods, apparatus, and systems for minimizing defectivity in top-coat-free lithography and improving reticle CD uniformity

US9798244B2 · kind B2 · utility

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20Claims
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Key dates

Filing dateNov 17, 2015
Grant dateOct 24, 2017
Priority date
Expiry dateMay 16, 2036

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F1/70
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Methods, apparatus, and system for minimizing defectivity in top-coat-free immersion photolithography are provided. Embodiments include forming a photomask by defining a first pattern including a main functional pattern in the photomask; and defining a second pattern including a sub-resolution fill pattern in the photomask in areas between or and/or within structures of the first pattern, the fill pattern having a pitch or range of pitches smaller than a minimum resolved pitch of the lithographic exposure and/or at least a part of the sub-resolution structures of the sub-resolution fill pattern not substantially modifying an imaging of any structure of the main functional pattern in the lithographic exposure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.