Electronic device having a redistribution area
US9799619B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2016 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Jul 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06541
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes an upper insulating layer on a substrate. An upper redistribution structure is embedded in the upper insulating layer. The upper redistribution structure includes an upper contact portion, an upper pad portion, and an upper line portion between the upper contact portion and the upper pad portion. A passivation layer is on the upper insulating layer and the upper redistribution structure. An upper opening is configured to pass through the passivation layer and expose the upper pad portion. Vertical thicknesses of the upper pad portion and the upper contact portion are greater than a vertical thickness of the upper line portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.