Jinho Chun
11Patents
2h-index
21Co-inventors
50Inventor score
Filing activity: Mar 26, 2015 → May 20, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9530706B2 | Semiconductor devices having hybrid stacking structures and methods of fabricating the same | Electricity | 9 | Active |
| US9799619B2 | Electronic device having a redistribution area | Electricity | 4 | Active |
| US11996358B2 | Semiconductor packages having first and second redistribution patterns | Electricity | 1 | Active |
| US11476176B2 | Semiconductor device having via protective layer | Electricity | 1 | Active |
| US11538783B2 | Semiconductor device | Electricity | 0 | Active |
| US12354987B2 | Semiconductor device | Electricity | 0 | Active |
| US12368093B2 | Semiconductor packages | Electricity | 0 | Active |
| US12142541B2 | Semiconductor package | Electricity | 0 | Active |
| US11444014B2 | Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same | Electricity | 0 | Active |
| US11984420B2 | Semiconductor device | Electricity | 0 | Active |
| US11978688B2 | Semiconductor device having via protective layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.