Method for detecting voids in interconnects and an inspection system
US9805909B1 · kind B1 · utility
5Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2016 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Sep 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection system that includes charged particle optics that irradiate a bottom of a hole with a charged particle beam propagated along an optical axis, an energy dispersive x-ray detector and a processor. The x-ray detector detects x-ray photons emitted from the bottom of the hole and generates detection signals indicative of the x-ray photons. The processor processes the detection signals to provide an estimate of the bottom of the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.