Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same
US9806015B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2017 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Jan 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes first bump pads on a first surface of an interconnection structure layer, elevated pads thicker than the first bump pads on the first surface of the interconnection structure layer, a first semiconductor device connected on the first bump pads, through mold ball connectors connected on the elevated pads, respectively, a molding layer disposed covering the first surface of the interconnection structure layer to expose a portion of each of the through mold ball connectors, outer connectors respectively attached to the through mold ball connectors, and a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.