Han Jun Bae
18Patents
2h-index
16Co-inventors
47Inventor score
Filing activity: May 29, 2007 → Jan 4, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9214410B2 | Stack packages and methods of fabricating the same | Electricity | 17 | Active |
| US8072046B2 | Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode | Electricity | 3 | Active |
| US9806015B1 | Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same | Electricity | 2 | Active |
| US9847285B1 | Semiconductor packages including heat spreaders and methods of manufacturing the same | Electricity | 2 | Active |
| US9659833B2 | Semiconductor packages, methods of manufacturing the same, electronic systems including the same, and memory cards including the same | Electricity | 1 | Active |
| US9543384B2 | Semiconductor package | Electricity | 1 | Active |
| US7759807B2 | Semiconductor package having structure for warpage prevention | Electricity | 1 | Active |
| US9196607B2 | Stack packages and methods of manufacturing the same | Electricity | 1 | Active |
| US9368482B2 | Stack packages and methods of fabricating the same | Electricity | 1 | Active |
| US12399014B2 | Map compression method for indoor positioning | Physics | 0 | Active |
| US9888567B2 | Flexible device including sliding interconnection structure | Electricity | 0 | Active |
| US11270958B2 | Semiconductor package including capacitor | Electricity | 0 | Active |
| US9343439B2 | Stack packages and methods of manufacturing the same | Electricity | 0 | Active |
| US11309303B2 | Semiconductor package including stacked semiconductor chips | Electricity | 0 | Active |
| US9806016B2 | Stretchable semiconductor packages and semiconductor devices including the same | Electricity | 0 | Active |
| US11501350B2 | Device and method for mediating heavy equipment and system using the same | Physics | 0 | Active |
| US8618637B2 | Semiconductor package using through-electrodes having voids | Electricity | 0 | Active |
| US9972568B2 | Stretchable semiconductor packages and semiconductor devices including the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.