Stretchable semiconductor packages and semiconductor devices including the same
US9806016B2 · kind B2 · utility
0Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2016 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Mar 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.