Plating method
US9809891B2 · kind B2 · utility
0Cited by
14References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2014 |
| Grant date | Nov 7, 2017 |
| Priority date | — |
| Expiry date | Jun 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Copper electroplating baths having a surface tension of ≦40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.