Optical backplane mirror

US9810843B2 · kind B2 · utility

Assignee

• NXP USA, Inc. · US

Inventors

• Tab A. Stephens · Kyle, US
• Perry H. Pelley · Austin, US
• Michael B. McShane · Austin, US

Key dates

• Filing date: Jun 10, 2013
• Grant date: Nov 7, 2017
• Expiry date: Sep 3, 2033

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12104
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An integrated circuit optical backplane die and associated semiconductor fabrication process are described for forming optical backplane mirror structures for perpendicularly deflecting optical signals out of the plane of the optical backplane die by selectively etching an optical waveguide semiconductor layer (103) on an optical backplane die wafer using an orientation-dependent anisotropic wet etch process to form a first recess opening (107) with angled semiconductor sidewall surfaces (106) on the optical waveguide semiconductor layer, where the angled semiconductor sidewall surfaces (106) are processed to form an optical backplane mirror (116) for perpendicularly deflecting optical signals to and from a lateral plane of the optical waveguide semiconductor layer.