Tab A. Stephens
38Patents
10h-index
46Co-inventors
71Inventor score
Filing activity: Jul 28, 2003 → Apr 3, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7504302B2 | Process of forming a non-volatile memory cell including a capacitor structure | Electricity | 229 | Active |
| US6919258B2 | Semiconductor device incorporating a defect controlled strained channel structure and method of making the same | Electricity | 91 | Expired |
| US7015517B2 | Semiconductor device incorporating a defect controlled strained channel structure and method of making the same | Electricity | 80 | Expired |
| US6831350B1 | Semiconductor structure with different lattice constant materials and method for forming the same | Electricity | 78 | Expired |
| US7339241B2 | FinFET structure with contacts | Electricity | 41 | Expired |
| US9094135B2 | Die stack with optical TSVs | Physics | 16 | Active |
| US6951783B2 | Confined spacers for double gate transistor semiconductor fabrication process | Electricity | 15 | Expired |
| US7091071B2 | Semiconductor fabrication process including recessed source/drain regions in an SOI wafer | Electricity | 12 | Expired |
| US9435952B2 | Integration of a MEMS beam with optical waveguide and deflection in two dimensions | Physics | 12 | Active |
| US7910482B2 | Method of forming a finFET and structure | Electricity | 10 | Active |
| US7491630B2 | Undoped gate poly integration for improved gate patterning and cobalt silicide extendibility | Electricity | 7 | Active |
| US9091820B2 | Communication system die stack | Physics | 7 | Active |
| US7829447B2 | Semiconductor structure pattern formation | Emerging Cross-Sectional Technologies | 7 | Active |
| US9810843B2 | Optical backplane mirror | Physics | 6 | Active |
| US9261556B2 | Optical wafer and die probe testing | Electricity | 6 | Active |
| US6972255B2 | Semiconductor device having an organic anti-reflective coating (ARC) and method therefor | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7235471B2 | Method for forming a semiconductor device having a silicide layer | Electricity | 5 | Expired |
| US7659156B2 | Method to selectively modulate gate work function through selective Ge condensation and high-K dielectric layer | Electricity | 4 | Active |
| US7208424B2 | Method of forming a semiconductor device having a metal layer | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8980734B2 | Gate security feature | Electricity | 3 | Active |
| US9070653B2 | Microelectronic assembly having a heat spreader for a plurality of die | Electricity | 3 | Active |
| US8680674B2 | Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices | Electricity | 3 | Active |
| US8258035B2 | Method to improve source/drain parasitics in vertical devices | Electricity | 3 | Active |
| US7074713B2 | Plasma enhanced nitride layer | Electricity | 3 | Expired |
| US9318451B2 | Wirebond recess for stacked die | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.