Patent · US Active

Wafer processing system with chuck assembly maintenance module

US9812344B2 · kind B2 · utility

1Cited by

3References

18Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Jason Rye · Kalispell, US
Mario David Silvetti · Fountain Hills, US
Randy Harris · Kalispell, US
Bryan Puch · Boulder, US
Vincent Steffan Francischetti · Columbia Falls, US
Satish Sundar · San Jose, US

Key dates

Filing date	Feb 3, 2015
Grant date	Nov 7, 2017
Priority date	—
Expiry date	Jul 27, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB08B2203/0229
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.