Patent · US Active

Semiconductor package with top side cooling heat sink thermal pathway

US9812373B2 · kind B2 · utility

4Cited by

1References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Christian Fachmann · Graz, AT
Ralf Otremba · Kaufbeuren, DE
Klaus Schiess · Allensbach, DE
Franz Stueckler · Friesach, AT

Key dates

Filing date	Dec 7, 2015
Grant date	Nov 7, 2017
Priority date	—
Expiry date	Dec 7, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic module includes a semiconductor package including a semiconductor chip and an electrically insulating encapsulation body encapsulating the semiconductor chip, the encapsulation body completely covering a second main face and four side faces of the semiconductor chip, wherein a first main face of the semiconductor chip that is opposite the first main face is exposed from the encapsulation body, a heat spreader attached to the semiconductor package, the heat spreader completely covering the first main face of the semiconductor chip, and an electrically insulating layer disposed on the heat spreader remote from the semiconductor package. The electrically insulating layer is completely separated from the semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.