Substrate processing apparatus and substrate processing method
US9818626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2013 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Aug 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When a substrate W is processed, a ring-shaped protective wall is located above the substrate held by the substrate holding unit and extends in a circumferential direction of the substrate. A radial position of an external periphery of a lower end of the protective wall is the same as a radial position of an internal periphery of a peripheral portion of an upper surface of the substrate held by a substrate holding unit, or is located at a radial outside. A first gap is formed between the protective wall and an upper surface of the substrate, a second gap is formed between the protective wall and a wall that defines the upper opening of the cup, and when the interior space of the cup is exhausted, a gas present above the substrate is introduced through the first gap and the second gap into the interior space of the cup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.