Ephemeral bonding
US9818636B2 · kind B2 · utility
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11References
8Claims
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Key dates
| Filing date | Oct 12, 2016 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Oct 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.