Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device
US9821469B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 27, 2013 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68778
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier system is provided with a wafer stage which holds a mounted wafer and is also movable along an XY plane, a chuck unit which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins, which can support from below the wafer held by the chuck unit on the wafer stage when the wafer stage is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer is measured by a Z position detection system, and based on the measurement results, the chuck unit and the vertical movement pins that hold (support) the wafer are independently driven.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.