Semiconductor structure and method for forming the same
US9824943B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 28, 2016 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Mar 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure with a stop layer for planarization process therein and a method for forming the same is disclosed. The method includes the steps of: forming a trench in a substrate and between active areas; filling the trench with isolation layer; doping the isolation layer with an element to form a doped isolation region; annealing the doped isolation region; and planarizing the annealed and doped isolation region and measuring a planarization depth thereof. The coefficients of thermal expansion (CTEs) of the stop layer, the dielectric layer, and the active area are different.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.