Die package with low electromagnetic interference interconnection
US9824997B2 · kind B2 · utility
0Cited by
3References
17Claims
0Family size
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Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Jul 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die package having lead structures connecting to a die that provide for electromagnetic interference reductions. Mixed impedance leads connected to the die have a first lead with a first metal core, a dielectric layer surrounding the first metal core, and first outer metal layer connected to ground; and a second lead with a second metal core, and a second dielectric layer surrounding the second metal core, and a second outer metal layer connected to ground. Each lead reducing susceptibility to EMI and crosstalk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.