Lithography tool with backside polisher
US9829806B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70783
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods for processing a substrate having a structure formed thereon and a system for processing a substrate are provided. A substrate is received from first processing equipment, where the first processing equipment has formed the structure on the substrate. A lithography process is performed on the received substrate. The lithography process includes exposing the substrate under an optical condition. The lithography process further includes polishing a backside of the substrate prior to the exposing of the substrate, where the polishing is configured to remove a topographical feature of the backside of the substrate or to remove a contaminant from the backside of the substrate. The substrate does not undergo a cleaning procedure during a period of time between i) the forming of the structure on the substrate, and ii) the exposing of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.