Semiconductor optical package and method
US9831357B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 31, 2013 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Nov 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
Abstract
Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.