Panel level fabrication of package substrates with integrated stiffeners
US9832860B2 · kind B2 · utility
4Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2014 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Nov 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Techniques are disclosed for forming a package substrate with integrated stiffener. A panel of package substrates are provided. An adhesion layer is then formed on each package substrate of the panel of package substrates. A panel of stiffeners are then attached to the panel of package substrates by the adhesion layer, each stiffener corresponding to a respective package substrate. The panel of package substrates is then singulated into individual package substrates with integrated stiffeners. The stiffeners on the singulated package substrates include tabs that extend to the edges of the package substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.