CPU package substrates with removable memory mechanical interfaces

US9832876B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Mani N. Prakash · Boulder, US
• Thomas T. Holden · Tumwater, US
• Jeffory L. Smalley · East Olympia, US
• Ram Viswanath · Phoenix, US
• Bassam N. Coury · Portland, US
• Dimitrios Ziakas · Hillsboro, US
• Chong J. Zhao · West Linn, US
• Jonathan W. Thibado · Beaverton, US
• Gregorio R. Murtagian · Phoenix, US
• Kuang Liu · Queen Creek, US
• Rajasekaran Swaminathan · Chandler, US
• Zhichao Zhang · Chandler, US
• John M. Lynch · Forest Grove, US
• David J. Llapitan · Tacoma, US
• Sanka Ganesan · Chandler, US
• Xiang Li · Nanhu, CN
• George Vergis · Fremont, US

Key dates

• Filing date: Dec 18, 2014
• Grant date: Nov 28, 2017
• Expiry date: Dec 18, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.