Liquid metal interconnects
US9835648B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2011 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Jun 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.