Method of forming a chip assembly with a die attach liquid

US9837381B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventor

• Alexander Heinrich · Bad Abbach, DE

Key dates

• Filing date: Sep 30, 2015
• Grant date: Dec 5, 2017
• Expiry date: Sep 30, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1579
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.