Circuit board assembly configuration
US9841791B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2014 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | May 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/14
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A rack unit configuration is described that includes a first printed circuit board (PCB) assembly interleaved with a second PCB assembly that is inverted with respect to the first PCB assembly. The configuration of the first PCB assembly and the second PCB assembly allow for increased component and power densities within computing systems, memory systems, etc. The increased density may be achieved while allowing sufficient mechanical clearance to allow easy component replacement and servicing (e.g., and hot pluggability). Power density may also be increased with PCB assemblies including nested and interleaved power modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.