David A. Secker
39Patents
5h-index
44Co-inventors
69Inventor score
Filing activity: Nov 14, 2000 → Sep 1, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6538336B1 | Wirebond assembly for high-speed integrated circuits | Electricity | 89 | Expired |
| US8588012B2 | Balanced on-die termination | Physics | 28 | Active |
| US9117496B2 | Memory device comprising programmable command-and-address and/or data interfaces | Electricity | 26 | Active |
| US9298228B1 | Memory capacity expansion using a memory riser | Physics | 14 | Active |
| US9489323B2 | Folded memory modules | Emerging Cross-Sectional Technologies | 13 | Active |
| US9734879B2 | Memory device comprising programmable command-and-address and/or data interfaces | Electricity | 5 | Active |
| US10756622B2 | Power management system switched capacitor voltage regulator with integrated passive device | Electricity | 4 | Active |
| US10192598B2 | Memory device comprising programmable command-and-address and/or data interfaces | Electricity | 4 | Active |
| US10770124B2 | Memory device comprising programmable command-and-address and/or data interfaces | Electricity | 3 | Active |
| US10217708B1 | High bandwidth routing for die to die interposer and on-chip applications | Electricity | 3 | Active |
| US10169257B2 | Module based data transfer | Emerging Cross-Sectional Technologies | 3 | Active |
| US11211105B2 | Memory device comprising programmable command-and-address and/or data interfaces | Electricity | 2 | Active |
| US9798628B2 | Memory mirroring | Emerging Cross-Sectional Technologies | 2 | Active |
| US9006907B2 | Distributed on-chip decoupling apparatus and method using package interconnect | Electricity | 2 | Active |
| US10866916B2 | Folded memory modules | Emerging Cross-Sectional Technologies | 1 | Active |
| US9870982B2 | Distributed on-chip decoupling apparatus and method using package interconnect | Electricity | 1 | Active |
| US11783879B2 | Memory device comprising programmable command-and-address and/or data interfaces | Electricity | 1 | Active |
| US11520508B2 | High performance, high capacity memory modules and systems | Emerging Cross-Sectional Technologies | 1 | Active |
| US9841791B2 | Circuit board assembly configuration | Electricity | 1 | Active |
| US11101732B2 | Power management system switched capacitor voltage regulator with integrated passive device | Electricity | 1 | Active |
| US10026666B2 | Stacked die package with aligned active and passive through-silicon vias | Electricity | 1 | Active |
| US11398692B2 | Socket with integrated flex connector | Electricity | 1 | Active |
| US9804931B2 | Memory mirroring utilizing single write operations | Emerging Cross-Sectional Technologies | 1 | Active |
| US11755521B2 | Folded memory modules | Emerging Cross-Sectional Technologies | 0 | Active |
| US9498951B2 | Inkjet nozzle device having dual chamber inlets and twofold symmetry | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.