Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity
US9845533B2 · kind B2 · utility
2Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2014 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Nov 12, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/303
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.