Transport module for a semiconductor fabrication device or coupling device

US9847241B2 · kind B2 · utility

Assignee

• AIXTRON SE · DE

Inventors

• Martin Freundt · Aachen, DE
• Walter Franken · Eschweiler, DE

Key dates

• Filing date: Apr 16, 2014
• Grant date: Dec 19, 2017
• Expiry date: Sep 24, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67775
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A transport module for loading and unloading a process module of a semiconductor production device includes a housing, which has a chamber that can be evacuated. The chamber has an opening that can be closed in a gas-tight manner by a closure device, which opens out into a first coupling duct associated with the transport module. The first coupling duct is connected with a flange plate using an elastic intermediate element, wherein the flange plate can be seated in a plane parallel, sealing manner on a flange plate of a second coupling duct associated with the process module. After opening the closure device, an evacuated loading and unloading duct to the process module is created. An inner and outer mounting section of the intermediate element is spaced apart from one another in the radial direction, with respect to the axis of the first coupling duct, by a deformation zone.