Patent · US Active

Electronic module and method of manufacturing the same

US9847274B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Winter · Mühlheim, DE
Ottmar Geitner · Pentling, DE
Ivan Nikitin · Regensburg, DE
Jürgen Högerl · Regensburg, DE

Key dates

Filing date	Dec 12, 2016
Grant date	Dec 19, 2017
Priority date	—
Expiry date	Dec 12, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.