Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
US9852955B2 · kind B2 · utility
4Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2016 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Nov 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.