Patent · US Active

Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component

US9852955B2 · kind B2 · utility

4Cited by
3References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 3, 2016
Grant dateDec 26, 2017
Priority date
Expiry dateNov 3, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76898
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.