Method and device for manufacturing semiconductor compound materials by means of vapour phase epitaxy
US9856579B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2011 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Jan 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor compound material, preferably a III-N-bulk crystal or a III-N-layer, is manufactured in a reactor by means of hydride vapor phase epitaxy (HVPE), wherein in a mixture of carrier gases a flow profile represented by local mass flow rates is formed in the reactor. The mixture can carry one or more reaction gases towards a substrate. Thereby, a concentration of hydrogen important for the reaction and deposition of reaction gases is adjusted at the substrate surface independently from the flow profile simultaneously formed in the reactor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.