Patent · US Active

Method and device for manufacturing semiconductor compound materials by means of vapour phase epitaxy

US9856579B2 · kind B2 · utility

0Cited by
7References
11Claims
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Key dates

Filing dateJan 20, 2011
Grant dateJan 2, 2018
Priority date
Expiry dateJan 20, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24612
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A semiconductor compound material, preferably a III-N-bulk crystal or a III-N-layer, is manufactured in a reactor by means of hydride vapor phase epitaxy (HVPE), wherein in a mixture of carrier gases a flow profile represented by local mass flow rates is formed in the reactor. The mixture can carry one or more reaction gases towards a substrate. Thereby, a concentration of hydrogen important for the reaction and deposition of reaction gases is adjusted at the substrate surface independently from the flow profile simultaneously formed in the reactor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.