Integrating manufacturing feedback into integrated circuit structure design
US9858368B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2011 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Oct 31, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Solutions for integrating manufacturing feedback into an integrated circuit design are disclosed. In one embodiment, a computer-implemented method is disclosed including: defining an acceptable yield requirement for a first integrated circuit product; obtaining manufacturing data about the first integrated circuit product; performing a regression analysis on data representing paths in the first integrated circuit product to define a plurality of parameter settings based upon the acceptable yield requirement and the manufacturing data; determining a projection corner associated with the parameter settings for satisfying the acceptable yield requirement; and modifying a design of a second integrated circuit product based upon the projection corner and the plurality of parameter settings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.