Defect classification using CAD-based context attributes
US9858658B2 · kind B2 · utility
7Cited by
28References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2012 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Apr 19, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for classification includes receiving an image of an area of a semiconductor wafer on which a pattern has been formed, the area containing an image location of interest, and receiving computer-aided design (CAD) data relating to the pattern comprising a CAD location of interest corresponding to the image location of interest. At least one value for one or more attributes of the image location of interest is computed based on a context of the CAD location of interest with respect to the CAD data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.