Substrate rinsing systems and methods

US9859135B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Jonathan Frankel · Los Gatos, US
• Brian J. Brown · Eastleigh, GB
• Vincent Steffan Francischetti · Columbia Falls, US
• Paul R. McHugh · Kalispell, US
• Kyle M. Hanson · Kalispell, US
• Ekaterina A. Mikhaylichenko · San Jose, US

Key dates

• Filing date: Feb 19, 2015
• Grant date: Jan 2, 2018
• Expiry date: May 28, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02052
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An example waterfall apparatus includes (1) a first portion of a first width having (a) a first plenum, a second plenum, and a restricted fluid path therebetween; (b) a first coupling surface; and (c) an inlet opening that creates a fluid path between the first coupling surface and the first plenum; and (2) a second portion of a second width larger than the first width and having (a) a second coupling surface; and (b) an inlet aligned with the first portion inlet opening. The first and second coupling surfaces form a slot that extends along at least a portion of a length of the waterfall apparatus and that connects to the second plenum. Fluid introduced into the second portion inlet fills the first plenum, travels through the restricted fluid path to the second plenum, and exits the slot between the first and second portions to form a rinsing fluid waterfall.