Heat isolation structures for high bandwidth interconnects
US9859188B2 · kind B2 · utility
1Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Jul 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die interconnect system having a plurality of connection pads, a heat generating element thermally isolated from the die, one or more leads extending from the die to the heat generating element, each lead having a metal core with a core diameter, a dielectric layer surrounding the metal core with a dielectric thickness, and an outer metal layer attached to ground, wherein one or more leads are exposed to ambient conditions and/or are convectively or contact cooled for at least a portion of their length to minimize heat transfer from the heat generating element to the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.