Semiconductor device having a chip under package

US9859251B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Gottfried Beer · Nittendorf, DE
• Peter Ossimitz · Munich, DE

Key dates

• Filing date: Feb 1, 2016
• Grant date: Jan 2, 2018
• Expiry date: Feb 1, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19104
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor device package includes an electronic component and an electrical interconnect. The electronic component is attached to the electrical interconnect. The electrical interconnect is configured to electrically couple the electronic component to external terminals of the semiconductor device package. The electrical interconnect has a first main face facing the electronic component and a second main face opposite the first main face. The semiconductor device package further includes a first semiconductor chip facing the second main face of the electrical interconnect.