Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool
US9865047B1 · kind B1 · utility
3Cited by
3References
29Claims
0Family size
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Key dates
| Filing date | Oct 15, 2015 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jun 16, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for providing improved wafer geometry measurements are disclosed. A wafer geometry measurement system may utilize techniques that enable the wafer geometry measurement system to identify and reduce wafer surface errors caused by structures such as patterns on the wafers being measured. The wafer geometry measurement system may also utilize techniques that enable the wafer geometry measurement system to accurately reconstruct patterned wafer surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.