Laser ashing of polyimide for semiconductor manufacturing
US9865564B2 · kind B2 · utility
3Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2015 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Feb 18, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.