Van Thanh Truong
6Patents
2h-index
11Co-inventors
40Inventor score
Filing activity: Jun 24, 2009 → Feb 18, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8689437B2 | Method for forming integrated circuit assembly | Emerging Cross-Sectional Technologies | 6 | Active |
| US9865564B2 | Laser ashing of polyimide for semiconductor manufacturing | Emerging Cross-Sectional Technologies | 3 | Active |
| US8614512B2 | Solder ball contact susceptible to lower stress | Electricity | 2 | Active |
| US9269603B2 | Temporary liquid thermal interface material for surface tension adhesion and thermal control | Electricity | 1 | Active |
| US8383505B2 | Solder ball contact susceptible to lower stress | Electricity | 0 | Active |
| US8999107B2 | Laser ashing of polyimide for semiconductor manufacturing | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.