Polishing pad with foundation layer and window attached thereto
US9868185B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2015 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Nov 19, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.