Process and apparatus for treating surfaces of wafer-shaped articles
US9870933B2 · kind B2 · utility
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15References
1Claims
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Key dates
| Filing date | Feb 8, 2013 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Feb 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for processing wafer-shaped articles utilizes at least first and second liquid-dispensing nozzles, wherein a first liquid-dispensing nozzle is positioned closer to an axis of rotation than the second liquid-dispensing nozzle. A liquid supply system supplies heated process liquid to the nozzles such that process liquid dispensed from the first nozzle has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed from the second liquid-dispensing nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.