Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof
US9875949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2015 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Dec 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided, which includes: a circuit structure having opposite first and second sides; at least an electronic element disposed on the first side of the circuit structure; an encapsulant formed on the first side of the circuit structure for encapsulating the electronic element; a dielectric layer formed on portions of the second side of the circuit structure; and a metal structure formed on the dielectric layer and the circuit structure. The metal structure has a first metal layer bonded to the circuit structure and a second metal layer formed on the first metal layer and the dielectric layer. Therefore, by replacing a conventional silicon interposer with the circuit structure, the invention eliminates the need to fabricate through silicon vias so as to greatly reduce the fabrication difficulty and cost. The invention further provides a method for fabricating the electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.