Integrated interface structure
US9875956B1 · kind B1 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2016 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Sep 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to interface structures and, more particularly, to integrated interface structures with both parallel and serial interfaces and methods of manufacture. The integrated interface structure includes: a substrate; a plurality of serial interface connections integrated on the substrate; and a plurality of parallel interface connections on the integrated substrate and within spaces between sets of the plurality of serial interface connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.