Patent · US Active

Heat shield ring for high growth rate EPI chamber

US9879358B2 · kind B2 · utility

1Cited by

3References

19Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Shinichi Oki · Chiba, JP
Yuji Aoki · Matsumoto, JP
Yoshinobu Mori · Yaidu, JP

Key dates

Filing date	May 25, 2016
Grant date	Jan 30, 2018
Priority date	—
Expiry date	Jun 15, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC30B25/12
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A heat shield assembly for an epitaxy chamber is described herein. The heat shield assembly has a heat shield member and a preheat member. The heat shield member is disposed on the preheat member. The heat shield member has a cutout portion that exposes a portion of the preheat member. The preheat member has a recessed portion to receive the heat shield member.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.